| commit | 9e41d93c975d403380b7debe05517d630c8e2836 | [log] [tgz] |
|---|---|---|
| author | Bob Moore <robert.moore@intel.com> | Thu Apr 10 19:06:39 2008 +0400 |
| committer | Len Brown <len.brown@intel.com> | Tue Apr 22 14:29:26 2008 -0400 |
| tree | 1f6e7afbca5c54cc16c7e8f88b93f1fccd7ae08a | |
| parent | 7f4ac9f91383a0707de559dc8fbca986fc2d302f [diff] |
ACPICA: Fixed a memory leak when Device or Thermal objects referenced in packages Problem introduced in fix for Package references. Signed-off-by: Bob Moore <robert.moore@intel.com> Signed-off-by: Alexey Starikovskiy <astarikovskiy@suse.de> Signed-off-by: Len Brown <len.brown@intel.com>