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#include "basic_circuit.h"

#include "parameter.h"

double wire_resistance(double resistivity, double wire_width,
                       double wire_thickness,
                       double barrier_thickness, double dishing_thickness,
                       double alpha_scatter) {
    double resistance;
    resistance = alpha_scatter * resistivity /
        ((wire_thickness - barrier_thickness - dishing_thickness) *
         (wire_width - 2 * barrier_thickness));
    return(resistance);
}

double wire_capacitance(double wire_width, double wire_thickness,
                        double wire_spacing,
                        double ild_thickness, double miller_value,
                        double horiz_dielectric_constant,
                        double vert_dielectric_constant, double fringe_cap) {
    double vertical_cap, sidewall_cap, total_cap;
    vertical_cap = 2 * PERMITTIVITY_FREE_SPACE * vert_dielectric_constant * wire_width / ild_thickness;
    sidewall_cap = 2 * PERMITTIVITY_FREE_SPACE * miller_value * horiz_dielectric_constant * wire_thickness / wire_spacing;
    total_cap = vertical_cap + sidewall_cap + fringe_cap;
    return(total_cap);
}


void init_tech_params(double technology, bool is_tag) {
    int    iter, tech, tech_lo, tech_hi;
    double curr_alpha, curr_vpp;
    double wire_width, wire_thickness, wire_spacing,
    fringe_cap, pmos_to_nmos_sizing_r;
//  double aspect_ratio,ild_thickness, miller_value = 1.5, horiz_dielectric_constant, vert_dielectric_constant;
    double barrier_thickness, dishing_thickness, alpha_scatter;
    double curr_vdd_dram_cell, curr_v_th_dram_access_transistor, curr_I_on_dram_cell, curr_c_dram_cell;

    uint32_t ram_cell_tech_type    = (is_tag) ? g_ip->tag_arr_ram_cell_tech_type : g_ip->data_arr_ram_cell_tech_type;
    uint32_t peri_global_tech_type = (is_tag) ? g_ip->tag_arr_peri_global_tech_type : g_ip->data_arr_peri_global_tech_type;

    technology  = technology * 1000.0;  // in the unit of nm

    // initialize parameters
    g_tp.reset();
    double gmp_to_gmn_multiplier_periph_global = 0;

    double curr_Wmemcella_dram, curr_Wmemcellpmos_dram, curr_Wmemcellnmos_dram,
    curr_area_cell_dram, curr_asp_ratio_cell_dram, curr_Wmemcella_sram,
    curr_Wmemcellpmos_sram, curr_Wmemcellnmos_sram, curr_area_cell_sram,
    curr_asp_ratio_cell_sram, curr_I_off_dram_cell_worst_case_length_temp;
    double curr_Wmemcella_cam, curr_Wmemcellpmos_cam, curr_Wmemcellnmos_cam, curr_area_cell_cam,//Sheng: CAM data
    curr_asp_ratio_cell_cam;
    double SENSE_AMP_D, SENSE_AMP_P; // J
    double area_cell_dram = 0;
    double asp_ratio_cell_dram = 0;
    double area_cell_sram = 0;
    double asp_ratio_cell_sram = 0;
    double area_cell_cam = 0;
    double asp_ratio_cell_cam = 0;
    double mobility_eff_periph_global = 0;
    double Vdsat_periph_global = 0;
    double nmos_effective_resistance_multiplier;
    double width_dram_access_transistor;

    double curr_logic_scaling_co_eff = 0;//This is based on the reported numbers of Intel Merom 65nm, Penryn45nm and IBM cell 90/65/45 date
    double curr_core_tx_density = 0;//this is density per um^2; 90, ...22nm based on Intel Penryn
    double curr_chip_layout_overhead = 0;
    double curr_macro_layout_overhead = 0;
    double curr_sckt_co_eff = 0;

    if (technology < 181 && technology > 179) {
        tech_lo = 180;
        tech_hi = 180;
    } else if (technology < 91 && technology > 89) {
        tech_lo = 90;
        tech_hi = 90;
    } else if (technology < 66 && technology > 64) {
        tech_lo = 65;
        tech_hi = 65;
    } else if (technology < 46 && technology > 44) {
        tech_lo = 45;
        tech_hi = 45;
    } else if (technology < 33 && technology > 31) {
        tech_lo = 32;
        tech_hi = 32;
    } else if (technology < 23 && technology > 21) {
        tech_lo = 22;
        tech_hi = 22;
        if (ram_cell_tech_type == 3 ) {
            cout << "current version does not support eDRAM technologies at "
                 << "22nm" << endl;
            exit(0);
        }
    } else if (technology < 180 && technology > 90) {
        tech_lo = 180;
        tech_hi = 90;
    } else if (technology < 90 && technology > 65) {
        tech_lo = 90;
        tech_hi = 65;
    } else if (technology < 65 && technology > 45) {
        tech_lo = 65;
        tech_hi = 45;
    } else if (technology < 45 && technology > 32) {
        tech_lo = 45;
        tech_hi = 32;
    } else if (technology < 32 && technology > 22) {
        tech_lo = 32;
        tech_hi = 22;
    }
//  else if (technology < 22 && technology > 16)
//    {
//      tech_lo = 22;
//      tech_hi = 16;
//    }
    else {
        cout << "Invalid technology nodes" << endl;
        exit(0);
    }

    double vdd[NUMBER_TECH_FLAVORS];
    double Lphy[NUMBER_TECH_FLAVORS];
    double Lelec[NUMBER_TECH_FLAVORS];
    double t_ox[NUMBER_TECH_FLAVORS];
    double v_th[NUMBER_TECH_FLAVORS];
    double c_ox[NUMBER_TECH_FLAVORS];
    double mobility_eff[NUMBER_TECH_FLAVORS];
    double Vdsat[NUMBER_TECH_FLAVORS];
    double c_g_ideal[NUMBER_TECH_FLAVORS];
    double c_fringe[NUMBER_TECH_FLAVORS];
    double c_junc[NUMBER_TECH_FLAVORS];
    double I_on_n[NUMBER_TECH_FLAVORS];
    double I_on_p[NUMBER_TECH_FLAVORS];
    double Rnchannelon[NUMBER_TECH_FLAVORS];
    double Rpchannelon[NUMBER_TECH_FLAVORS];
    double n_to_p_eff_curr_drv_ratio[NUMBER_TECH_FLAVORS];
    double I_off_n[NUMBER_TECH_FLAVORS][101];
    double I_g_on_n[NUMBER_TECH_FLAVORS][101];
    double gmp_to_gmn_multiplier[NUMBER_TECH_FLAVORS];
    double long_channel_leakage_reduction[NUMBER_TECH_FLAVORS];

    for (iter = 0; iter <= 1; ++iter) {
        // linear interpolation
        if (iter == 0) {
            tech = tech_lo;
            if (tech_lo == tech_hi) {
                curr_alpha = 1;
            } else {
                curr_alpha = (technology - tech_hi) / (tech_lo - tech_hi);
            }
        } else {
            tech = tech_hi;
            if (tech_lo == tech_hi) {
                break;
            } else {
                curr_alpha = (tech_lo - technology) / (tech_lo - tech_hi);
            }
        }

        if (tech == 180) {
            //180nm technology-node. Corresponds to year 1999 in ITRS
            //Only HP transistor was of interest that 180nm since leakage power was not a big issue. Performance was the king
            //MASTAR does not contain data for 0.18um process. The following parameters are projected based on ITRS 2000 update and IBM 0.18 Cu Spice input
            bool Aggre_proj = false;
            SENSE_AMP_D = .28e-9; // s
            SENSE_AMP_P = 14.7e-15; // J
            vdd[0]   = 1.5;
            Lphy[0]  = 0.12;//Lphy is the physical gate-length. micron
            Lelec[0] = 0.10;//Lelec is the electrical gate-length. micron
            t_ox[0]  = 1.2e-3 * (Aggre_proj ? 1.9 / 1.2 : 2);//micron
            v_th[0]  = Aggre_proj ? 0.36 : 0.4407;//V
            c_ox[0]  = 1.79e-14 * (Aggre_proj ? 1.9 / 1.2 : 2);//F/micron2
            mobility_eff[0] = 302.16 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[0] = 0.128 * 2; //V
            c_g_ideal[0] = (Aggre_proj ? 1.9 / 1.2 : 2) * 6.64e-16;//F/micron
            c_fringe[0]  = (Aggre_proj ? 1.9 / 1.2 : 2) * 0.08e-15;//F/micron
            c_junc[0] = (Aggre_proj ? 1.9 / 1.2 : 2) * 1e-15;//F/micron2
            I_on_n[0] = 750e-6;//A/micron
            I_on_p[0] = 350e-6;//A/micron
            //Note that nmos_effective_resistance_multiplier, n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier values are calculated offline
            nmos_effective_resistance_multiplier = 1.54;
            n_to_p_eff_curr_drv_ratio[0] = 2.45;
            gmp_to_gmn_multiplier[0] = 1.22;
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
            long_channel_leakage_reduction[0] = 1;
            I_off_n[0][0]  = 7e-10;//A/micron
            I_off_n[0][10] = 8.26e-10;
            I_off_n[0][20] = 9.74e-10;
            I_off_n[0][30] = 1.15e-9;
            I_off_n[0][40] = 1.35e-9;
            I_off_n[0][50] = 1.60e-9;
            I_off_n[0][60] = 1.88e-9;
            I_off_n[0][70] = 2.29e-9;
            I_off_n[0][80] = 2.70e-9;
            I_off_n[0][90] = 3.19e-9;
            I_off_n[0][100] = 3.76e-9;

            I_g_on_n[0][0]  = 1.65e-10;//A/micron
            I_g_on_n[0][10] = 1.65e-10;
            I_g_on_n[0][20] = 1.65e-10;
            I_g_on_n[0][30] = 1.65e-10;
            I_g_on_n[0][40] = 1.65e-10;
            I_g_on_n[0][50] = 1.65e-10;
            I_g_on_n[0][60] = 1.65e-10;
            I_g_on_n[0][70] = 1.65e-10;
            I_g_on_n[0][80] = 1.65e-10;
            I_g_on_n[0][90] = 1.65e-10;
            I_g_on_n[0][100] = 1.65e-10;

            //SRAM cell properties
            curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;//360
            curr_asp_ratio_cell_cam = 2.92;//2.5
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff  = 1.5;//linear scaling from 90nm
            curr_core_tx_density       = 1.25 * 0.7 * 0.7 * 0.4;
            curr_sckt_co_eff           = 1.11;
            curr_chip_layout_overhead  = 1.0;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.0;//EDA placement and routing tool rule of thumb

        }

        if (tech == 90) {
            SENSE_AMP_D = .28e-9; // s
            SENSE_AMP_P = 14.7e-15; // J
            //90nm technology-node. Corresponds to year 2004 in ITRS
            //ITRS HP device type
            vdd[0]   = 1.2;
            Lphy[0]  = 0.037;//Lphy is the physical gate-length. micron
            Lelec[0] = 0.0266;//Lelec is the electrical gate-length. micron
            t_ox[0]  = 1.2e-3;//micron
            v_th[0]  = 0.23707;//V
            c_ox[0]  = 1.79e-14;//F/micron2
            mobility_eff[0] = 342.16 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[0] = 0.128; //V
            c_g_ideal[0] = 6.64e-16;//F/micron
            c_fringe[0]  = 0.08e-15;//F/micron
            c_junc[0] = 1e-15;//F/micron2
            I_on_n[0] = 1076.9e-6;//A/micron
            I_on_p[0] = 712.6e-6;//A/micron
            //Note that nmos_effective_resistance_multiplier, n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier values are calculated offline
            nmos_effective_resistance_multiplier = 1.54;
            n_to_p_eff_curr_drv_ratio[0] = 2.45;
            gmp_to_gmn_multiplier[0] = 1.22;
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
            long_channel_leakage_reduction[0] = 1;
            I_off_n[0][0]  = 3.24e-8;//A/micron
            I_off_n[0][10] = 4.01e-8;
            I_off_n[0][20] = 4.90e-8;
            I_off_n[0][30] = 5.92e-8;
            I_off_n[0][40] = 7.08e-8;
            I_off_n[0][50] = 8.38e-8;
            I_off_n[0][60] = 9.82e-8;
            I_off_n[0][70] = 1.14e-7;
            I_off_n[0][80] = 1.29e-7;
            I_off_n[0][90] = 1.43e-7;
            I_off_n[0][100] = 1.54e-7;

            I_g_on_n[0][0]  = 1.65e-8;//A/micron
            I_g_on_n[0][10] = 1.65e-8;
            I_g_on_n[0][20] = 1.65e-8;
            I_g_on_n[0][30] = 1.65e-8;
            I_g_on_n[0][40] = 1.65e-8;
            I_g_on_n[0][50] = 1.65e-8;
            I_g_on_n[0][60] = 1.65e-8;
            I_g_on_n[0][70] = 1.65e-8;
            I_g_on_n[0][80] = 1.65e-8;
            I_g_on_n[0][90] = 1.65e-8;
            I_g_on_n[0][100] = 1.65e-8;

            //ITRS LSTP device type
            vdd[1]   = 1.3;
            Lphy[1]  = 0.075;
            Lelec[1] = 0.0486;
            t_ox[1]  = 2.2e-3;
            v_th[1]  = 0.48203;
            c_ox[1]  = 1.22e-14;
            mobility_eff[1] = 356.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[1] = 0.373;
            c_g_ideal[1] = 9.15e-16;
            c_fringe[1]  = 0.08e-15;
            c_junc[1] = 1e-15;
            I_on_n[1] = 503.6e-6;
            I_on_p[1] = 235.1e-6;
            nmos_effective_resistance_multiplier = 1.92;
            n_to_p_eff_curr_drv_ratio[1] = 2.44;
            gmp_to_gmn_multiplier[1] = 0.88;
            Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
            Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
            long_channel_leakage_reduction[1] = 1;
            I_off_n[1][0]  = 2.81e-12;
            I_off_n[1][10] = 4.76e-12;
            I_off_n[1][20] = 7.82e-12;
            I_off_n[1][30] = 1.25e-11;
            I_off_n[1][40] = 1.94e-11;
            I_off_n[1][50] = 2.94e-11;
            I_off_n[1][60] = 4.36e-11;
            I_off_n[1][70] = 6.32e-11;
            I_off_n[1][80] = 8.95e-11;
            I_off_n[1][90] = 1.25e-10;
            I_off_n[1][100] = 1.7e-10;

            I_g_on_n[1][0]  = 3.87e-11;//A/micron
            I_g_on_n[1][10] = 3.87e-11;
            I_g_on_n[1][20] = 3.87e-11;
            I_g_on_n[1][30] = 3.87e-11;
            I_g_on_n[1][40] = 3.87e-11;
            I_g_on_n[1][50] = 3.87e-11;
            I_g_on_n[1][60] = 3.87e-11;
            I_g_on_n[1][70] = 3.87e-11;
            I_g_on_n[1][80] = 3.87e-11;
            I_g_on_n[1][90] = 3.87e-11;
            I_g_on_n[1][100] = 3.87e-11;

            //ITRS LOP device type
            vdd[2] = 0.9;
            Lphy[2] = 0.053;
            Lelec[2] = 0.0354;
            t_ox[2] = 1.5e-3;
            v_th[2] = 0.30764;
            c_ox[2] = 1.59e-14;
            mobility_eff[2] = 460.39 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[2] = 0.113;
            c_g_ideal[2] = 8.45e-16;
            c_fringe[2] = 0.08e-15;
            c_junc[2] = 1e-15;
            I_on_n[2] = 386.6e-6;
            I_on_p[2] = 209.7e-6;
            nmos_effective_resistance_multiplier = 1.77;
            n_to_p_eff_curr_drv_ratio[2] = 2.54;
            gmp_to_gmn_multiplier[2] = 0.98;
            Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
            Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
            long_channel_leakage_reduction[2] = 1;
            I_off_n[2][0] = 2.14e-9;
            I_off_n[2][10] = 2.9e-9;
            I_off_n[2][20] = 3.87e-9;
            I_off_n[2][30] = 5.07e-9;
            I_off_n[2][40] = 6.54e-9;
            I_off_n[2][50] = 8.27e-8;
            I_off_n[2][60] = 1.02e-7;
            I_off_n[2][70] = 1.20e-7;
            I_off_n[2][80] = 1.36e-8;
            I_off_n[2][90] = 1.52e-8;
            I_off_n[2][100] = 1.73e-8;

            I_g_on_n[2][0]  = 4.31e-8;//A/micron
            I_g_on_n[2][10] = 4.31e-8;
            I_g_on_n[2][20] = 4.31e-8;
            I_g_on_n[2][30] = 4.31e-8;
            I_g_on_n[2][40] = 4.31e-8;
            I_g_on_n[2][50] = 4.31e-8;
            I_g_on_n[2][60] = 4.31e-8;
            I_g_on_n[2][70] = 4.31e-8;
            I_g_on_n[2][80] = 4.31e-8;
            I_g_on_n[2][90] = 4.31e-8;
            I_g_on_n[2][100] = 4.31e-8;

            if (ram_cell_tech_type == lp_dram) {
                //LP-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.2;
                Lphy[3] = 0.12;
                Lelec[3] = 0.0756;
                curr_v_th_dram_access_transistor = 0.4545;
                width_dram_access_transistor = 0.14;
                curr_I_on_dram_cell = 45e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 21.1e-12;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 0.168;
                curr_asp_ratio_cell_dram = 1.46;
                curr_c_dram_cell = 20e-15;

                //LP-DRAM wordline transistor parameters
                curr_vpp = 1.6;
                t_ox[3] = 2.2e-3;
                v_th[3] = 0.4545;
                c_ox[3] = 1.22e-14;
                mobility_eff[3] =  323.95 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.3;
                c_g_ideal[3] = 1.47e-15;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 321.6e-6;
                I_on_p[3] = 203.3e-6;
                nmos_effective_resistance_multiplier = 1.65;
                n_to_p_eff_curr_drv_ratio[3] = 1.95;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 1.42e-11;
                I_off_n[3][10] = 2.25e-11;
                I_off_n[3][20] = 3.46e-11;
                I_off_n[3][30] = 5.18e-11;
                I_off_n[3][40] = 7.58e-11;
                I_off_n[3][50] = 1.08e-10;
                I_off_n[3][60] = 1.51e-10;
                I_off_n[3][70] = 2.02e-10;
                I_off_n[3][80] = 2.57e-10;
                I_off_n[3][90] = 3.14e-10;
                I_off_n[3][100] = 3.85e-10;
            } else if (ram_cell_tech_type == comm_dram) {
                //COMM-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.6;
                Lphy[3] = 0.09;
                Lelec[3] = 0.0576;
                curr_v_th_dram_access_transistor = 1;
                width_dram_access_transistor = 0.09;
                curr_I_on_dram_cell = 20e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 6 * 0.09 * 0.09;
                curr_asp_ratio_cell_dram = 1.5;
                curr_c_dram_cell = 30e-15;

                //COMM-DRAM wordline transistor parameters
                curr_vpp = 3.7;
                t_ox[3] = 5.5e-3;
                v_th[3] = 1.0;
                c_ox[3] = 5.65e-15;
                mobility_eff[3] =  302.2 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.32;
                c_g_ideal[3] = 5.08e-16;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 1094.3e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.62;
                n_to_p_eff_curr_drv_ratio[3] = 2.05;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 5.80e-15;
                I_off_n[3][10] = 1.21e-14;
                I_off_n[3][20] = 2.42e-14;
                I_off_n[3][30] = 4.65e-14;
                I_off_n[3][40] = 8.60e-14;
                I_off_n[3][50] = 1.54e-13;
                I_off_n[3][60] = 2.66e-13;
                I_off_n[3][70] = 4.45e-13;
                I_off_n[3][80] = 7.17e-13;
                I_off_n[3][90] = 1.11e-12;
                I_off_n[3][100] = 1.67e-12;
            }

            //SRAM cell properties
            curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;//360
            curr_asp_ratio_cell_cam = 2.92;//2.5
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff  = 1;
            curr_core_tx_density       = 1.25 * 0.7 * 0.7;
            curr_sckt_co_eff           = 1.1539;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb


        }

        if (tech == 65) {
            //65nm technology-node. Corresponds to year 2007 in ITRS
            //ITRS HP device type
            SENSE_AMP_D = .2e-9; // s
            SENSE_AMP_P = 5.7e-15; // J
            vdd[0] = 1.1;
            Lphy[0] = 0.025;
            Lelec[0] = 0.019;
            t_ox[0] = 1.1e-3;
            v_th[0] = .19491;
            c_ox[0] = 1.88e-14;
            mobility_eff[0] = 436.24 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[0] = 7.71e-2;
            c_g_ideal[0] = 4.69e-16;
            c_fringe[0] = 0.077e-15;
            c_junc[0] = 1e-15;
            I_on_n[0] = 1197.2e-6;
            I_on_p[0] = 870.8e-6;
            nmos_effective_resistance_multiplier = 1.50;
            n_to_p_eff_curr_drv_ratio[0] = 2.41;
            gmp_to_gmn_multiplier[0] = 1.38;
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
            long_channel_leakage_reduction[0] = 1 / 3.74;
            //Using MASTAR, @380K, increase Lgate until Ion reduces to 90% or Lgate increase by 10%, whichever comes first
            //Ioff(Lgate normal)/Ioff(Lgate long)= 3.74.
            I_off_n[0][0] = 1.96e-7;
            I_off_n[0][10] = 2.29e-7;
            I_off_n[0][20] = 2.66e-7;
            I_off_n[0][30] = 3.05e-7;
            I_off_n[0][40] = 3.49e-7;
            I_off_n[0][50] = 3.95e-7;
            I_off_n[0][60] = 4.45e-7;
            I_off_n[0][70] = 4.97e-7;
            I_off_n[0][80] = 5.48e-7;
            I_off_n[0][90] = 5.94e-7;
            I_off_n[0][100] = 6.3e-7;
            I_g_on_n[0][0]  = 4.09e-8;//A/micron
            I_g_on_n[0][10] = 4.09e-8;
            I_g_on_n[0][20] = 4.09e-8;
            I_g_on_n[0][30] = 4.09e-8;
            I_g_on_n[0][40] = 4.09e-8;
            I_g_on_n[0][50] = 4.09e-8;
            I_g_on_n[0][60] = 4.09e-8;
            I_g_on_n[0][70] = 4.09e-8;
            I_g_on_n[0][80] = 4.09e-8;
            I_g_on_n[0][90] = 4.09e-8;
            I_g_on_n[0][100] = 4.09e-8;

            //ITRS LSTP device type
            vdd[1] = 1.2;
            Lphy[1] = 0.045;
            Lelec[1] = 0.0298;
            t_ox[1] = 1.9e-3;
            v_th[1] = 0.52354;
            c_ox[1] = 1.36e-14;
            mobility_eff[1] = 341.21 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[1] = 0.128;
            c_g_ideal[1] = 6.14e-16;
            c_fringe[1] = 0.08e-15;
            c_junc[1] = 1e-15;
            I_on_n[1] = 519.2e-6;
            I_on_p[1] = 266e-6;
            nmos_effective_resistance_multiplier = 1.96;
            n_to_p_eff_curr_drv_ratio[1] = 2.23;
            gmp_to_gmn_multiplier[1] = 0.99;
            Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
            Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
            long_channel_leakage_reduction[1] = 1 / 2.82;
            I_off_n[1][0] = 9.12e-12;
            I_off_n[1][10] = 1.49e-11;
            I_off_n[1][20] = 2.36e-11;
            I_off_n[1][30] = 3.64e-11;
            I_off_n[1][40] = 5.48e-11;
            I_off_n[1][50] = 8.05e-11;
            I_off_n[1][60] = 1.15e-10;
            I_off_n[1][70] = 1.59e-10;
            I_off_n[1][80] = 2.1e-10;
            I_off_n[1][90] = 2.62e-10;
            I_off_n[1][100] = 3.21e-10;

            I_g_on_n[1][0]  = 1.09e-10;//A/micron
            I_g_on_n[1][10] = 1.09e-10;
            I_g_on_n[1][20] = 1.09e-10;
            I_g_on_n[1][30] = 1.09e-10;
            I_g_on_n[1][40] = 1.09e-10;
            I_g_on_n[1][50] = 1.09e-10;
            I_g_on_n[1][60] = 1.09e-10;
            I_g_on_n[1][70] = 1.09e-10;
            I_g_on_n[1][80] = 1.09e-10;
            I_g_on_n[1][90] = 1.09e-10;
            I_g_on_n[1][100] = 1.09e-10;

            //ITRS LOP device type
            vdd[2] = 0.8;
            Lphy[2] = 0.032;
            Lelec[2] = 0.0216;
            t_ox[2] = 1.2e-3;
            v_th[2] = 0.28512;
            c_ox[2] = 1.87e-14;
            mobility_eff[2] = 495.19 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[2] = 0.292;
            c_g_ideal[2] = 6e-16;
            c_fringe[2] = 0.08e-15;
            c_junc[2] = 1e-15;
            I_on_n[2] = 573.1e-6;
            I_on_p[2] = 340.6e-6;
            nmos_effective_resistance_multiplier = 1.82;
            n_to_p_eff_curr_drv_ratio[2] = 2.28;
            gmp_to_gmn_multiplier[2] = 1.11;
            Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
            Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
            long_channel_leakage_reduction[2] = 1 / 2.05;
            I_off_n[2][0] = 4.9e-9;
            I_off_n[2][10] = 6.49e-9;
            I_off_n[2][20] = 8.45e-9;
            I_off_n[2][30] = 1.08e-8;
            I_off_n[2][40] = 1.37e-8;
            I_off_n[2][50] = 1.71e-8;
            I_off_n[2][60] = 2.09e-8;
            I_off_n[2][70] = 2.48e-8;
            I_off_n[2][80] = 2.84e-8;
            I_off_n[2][90] = 3.13e-8;
            I_off_n[2][100] = 3.42e-8;

            I_g_on_n[2][0]  = 9.61e-9;//A/micron
            I_g_on_n[2][10] = 9.61e-9;
            I_g_on_n[2][20] = 9.61e-9;
            I_g_on_n[2][30] = 9.61e-9;
            I_g_on_n[2][40] = 9.61e-9;
            I_g_on_n[2][50] = 9.61e-9;
            I_g_on_n[2][60] = 9.61e-9;
            I_g_on_n[2][70] = 9.61e-9;
            I_g_on_n[2][80] = 9.61e-9;
            I_g_on_n[2][90] = 9.61e-9;
            I_g_on_n[2][100] = 9.61e-9;

            if (ram_cell_tech_type == lp_dram) {
                //LP-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.2;
                Lphy[3] = 0.12;
                Lelec[3] = 0.0756;
                curr_v_th_dram_access_transistor = 0.43806;
                width_dram_access_transistor = 0.09;
                curr_I_on_dram_cell = 36e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 19.6e-12;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 0.11;
                curr_asp_ratio_cell_dram = 1.46;
                curr_c_dram_cell = 20e-15;

                //LP-DRAM wordline transistor parameters
                curr_vpp = 1.6;
                t_ox[3] = 2.2e-3;
                v_th[3] = 0.43806;
                c_ox[3] = 1.22e-14;
                mobility_eff[3] =  328.32 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.43806;
                c_g_ideal[3] = 1.46e-15;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15 ;
                I_on_n[3] = 399.8e-6;
                I_on_p[3] = 243.4e-6;
                nmos_effective_resistance_multiplier = 1.65;
                n_to_p_eff_curr_drv_ratio[3] = 2.05;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0]  = 2.23e-11;
                I_off_n[3][10] = 3.46e-11;
                I_off_n[3][20] = 5.24e-11;
                I_off_n[3][30] = 7.75e-11;
                I_off_n[3][40] = 1.12e-10;
                I_off_n[3][50] = 1.58e-10;
                I_off_n[3][60] = 2.18e-10;
                I_off_n[3][70] = 2.88e-10;
                I_off_n[3][80] = 3.63e-10;
                I_off_n[3][90] = 4.41e-10;
                I_off_n[3][100] = 5.36e-10;
            } else if (ram_cell_tech_type == comm_dram) {
                //COMM-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.3;
                Lphy[3] = 0.065;
                Lelec[3] = 0.0426;
                curr_v_th_dram_access_transistor = 1;
                width_dram_access_transistor = 0.065;
                curr_I_on_dram_cell = 20e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 6 * 0.065 * 0.065;
                curr_asp_ratio_cell_dram = 1.5;
                curr_c_dram_cell = 30e-15;

                //COMM-DRAM wordline transistor parameters
                curr_vpp = 3.3;
                t_ox[3] = 5e-3;
                v_th[3] = 1.0;
                c_ox[3] = 6.16e-15;
                mobility_eff[3] =  303.44 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.385;
                c_g_ideal[3] = 4e-16;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15 ;
                I_on_n[3] = 1031e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.69;
                n_to_p_eff_curr_drv_ratio[3] = 2.39;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0]  = 1.80e-14;
                I_off_n[3][10] = 3.64e-14;
                I_off_n[3][20] = 7.03e-14;
                I_off_n[3][30] = 1.31e-13;
                I_off_n[3][40] = 2.35e-13;
                I_off_n[3][50] = 4.09e-13;
                I_off_n[3][60] = 6.89e-13;
                I_off_n[3][70] = 1.13e-12;
                I_off_n[3][80] = 1.78e-12;
                I_off_n[3][90] = 2.71e-12;
                I_off_n[3][100] = 3.99e-12;
            }

            //SRAM cell properties
            curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_cam = 2.92;
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff = 0.7; //Rather than scale proportionally to square of feature size, only scale linearly according to IBM cell processor
            curr_core_tx_density      = 1.25 * 0.7;
            curr_sckt_co_eff           = 1.1359;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
        }

        if (tech == 45) {
            //45nm technology-node. Corresponds to year 2010 in ITRS
            //ITRS HP device type
            SENSE_AMP_D = .04e-9; // s
            SENSE_AMP_P = 2.7e-15; // J
            vdd[0] = 1.0;
            Lphy[0] = 0.018;
            Lelec[0] = 0.01345;
            t_ox[0] = 0.65e-3;
            v_th[0] = .18035;
            c_ox[0] = 3.77e-14;
            mobility_eff[0] = 266.68 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[0] = 9.38E-2;
            c_g_ideal[0] = 6.78e-16;
            c_fringe[0] = 0.05e-15;
            c_junc[0] = 1e-15;
            I_on_n[0] = 2046.6e-6;
            //There are certain problems with the ITRS PMOS numbers in MASTAR for 45nm. So we are using 65nm values of
            //n_to_p_eff_curr_drv_ratio and gmp_to_gmn_multiplier for 45nm
            I_on_p[0] = I_on_n[0] / 2;//This value is fixed arbitrarily but I_on_p is not being used in CACTI
            nmos_effective_resistance_multiplier = 1.51;
            n_to_p_eff_curr_drv_ratio[0] = 2.41;
            gmp_to_gmn_multiplier[0] = 1.38;
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];
            //Using MASTAR, @380K, increase Lgate until Ion reduces to 90%,
            //Ioff(Lgate normal)/Ioff(Lgate long)= 3.74
            long_channel_leakage_reduction[0] = 1 / 3.546;
            I_off_n[0][0] = 2.8e-7;
            I_off_n[0][10] = 3.28e-7;
            I_off_n[0][20] = 3.81e-7;
            I_off_n[0][30] = 4.39e-7;
            I_off_n[0][40] = 5.02e-7;
            I_off_n[0][50] = 5.69e-7;
            I_off_n[0][60] = 6.42e-7;
            I_off_n[0][70] = 7.2e-7;
            I_off_n[0][80] = 8.03e-7;
            I_off_n[0][90] = 8.91e-7;
            I_off_n[0][100] = 9.84e-7;

            I_g_on_n[0][0]  = 3.59e-8;//A/micron
            I_g_on_n[0][10] = 3.59e-8;
            I_g_on_n[0][20] = 3.59e-8;
            I_g_on_n[0][30] = 3.59e-8;
            I_g_on_n[0][40] = 3.59e-8;
            I_g_on_n[0][50] = 3.59e-8;
            I_g_on_n[0][60] = 3.59e-8;
            I_g_on_n[0][70] = 3.59e-8;
            I_g_on_n[0][80] = 3.59e-8;
            I_g_on_n[0][90] = 3.59e-8;
            I_g_on_n[0][100] = 3.59e-8;

            //ITRS LSTP device type
            vdd[1] = 1.1;
            Lphy[1] =  0.028;
            Lelec[1] = 0.0212;
            t_ox[1] = 1.4e-3;
            v_th[1] = 0.50245;
            c_ox[1] = 2.01e-14;
            mobility_eff[1] =  363.96 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[1] = 9.12e-2;
            c_g_ideal[1] = 5.18e-16;
            c_fringe[1] = 0.08e-15;
            c_junc[1] = 1e-15;
            I_on_n[1] = 666.2e-6;
            I_on_p[1] = I_on_n[1] / 2;
            nmos_effective_resistance_multiplier = 1.99;
            n_to_p_eff_curr_drv_ratio[1] = 2.23;
            gmp_to_gmn_multiplier[1] = 0.99;
            Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
            Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
            long_channel_leakage_reduction[1] = 1 / 2.08;
            I_off_n[1][0] = 1.01e-11;
            I_off_n[1][10] = 1.65e-11;
            I_off_n[1][20] = 2.62e-11;
            I_off_n[1][30] = 4.06e-11;
            I_off_n[1][40] = 6.12e-11;
            I_off_n[1][50] = 9.02e-11;
            I_off_n[1][60] = 1.3e-10;
            I_off_n[1][70] = 1.83e-10;
            I_off_n[1][80] = 2.51e-10;
            I_off_n[1][90] = 3.29e-10;
            I_off_n[1][100] = 4.1e-10;

            I_g_on_n[1][0]  = 9.47e-12;//A/micron
            I_g_on_n[1][10] = 9.47e-12;
            I_g_on_n[1][20] = 9.47e-12;
            I_g_on_n[1][30] = 9.47e-12;
            I_g_on_n[1][40] = 9.47e-12;
            I_g_on_n[1][50] = 9.47e-12;
            I_g_on_n[1][60] = 9.47e-12;
            I_g_on_n[1][70] = 9.47e-12;
            I_g_on_n[1][80] = 9.47e-12;
            I_g_on_n[1][90] = 9.47e-12;
            I_g_on_n[1][100] = 9.47e-12;

            //ITRS LOP device type
            vdd[2] = 0.7;
            Lphy[2] = 0.022;
            Lelec[2] = 0.016;
            t_ox[2] = 0.9e-3;
            v_th[2] = 0.22599;
            c_ox[2] = 2.82e-14;//F/micron2
            mobility_eff[2] = 508.9 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[2] = 5.71e-2;
            c_g_ideal[2] = 6.2e-16;
            c_fringe[2] = 0.073e-15;
            c_junc[2] = 1e-15;
            I_on_n[2] = 748.9e-6;
            I_on_p[2] = I_on_n[2] / 2;
            nmos_effective_resistance_multiplier = 1.76;
            n_to_p_eff_curr_drv_ratio[2] = 2.28;
            gmp_to_gmn_multiplier[2] = 1.11;
            Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
            Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
            long_channel_leakage_reduction[2] = 1 / 1.92;
            I_off_n[2][0] = 4.03e-9;
            I_off_n[2][10] = 5.02e-9;
            I_off_n[2][20] = 6.18e-9;
            I_off_n[2][30] = 7.51e-9;
            I_off_n[2][40] = 9.04e-9;
            I_off_n[2][50] = 1.08e-8;
            I_off_n[2][60] = 1.27e-8;
            I_off_n[2][70] = 1.47e-8;
            I_off_n[2][80] = 1.66e-8;
            I_off_n[2][90] = 1.84e-8;
            I_off_n[2][100] = 2.03e-8;

            I_g_on_n[2][0]  = 3.24e-8;//A/micron
            I_g_on_n[2][10] = 4.01e-8;
            I_g_on_n[2][20] = 4.90e-8;
            I_g_on_n[2][30] = 5.92e-8;
            I_g_on_n[2][40] = 7.08e-8;
            I_g_on_n[2][50] = 8.38e-8;
            I_g_on_n[2][60] = 9.82e-8;
            I_g_on_n[2][70] = 1.14e-7;
            I_g_on_n[2][80] = 1.29e-7;
            I_g_on_n[2][90] = 1.43e-7;
            I_g_on_n[2][100] = 1.54e-7;

            if (ram_cell_tech_type == lp_dram) {
                //LP-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.1;
                Lphy[3] = 0.078;
                Lelec[3] = 0.0504;// Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
                curr_v_th_dram_access_transistor = 0.44559;
                width_dram_access_transistor = 0.079;
                curr_I_on_dram_cell = 36e-6;//A
                curr_I_off_dram_cell_worst_case_length_temp = 19.5e-12;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram  = 0;
                curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
                curr_asp_ratio_cell_dram = 1.46;
                curr_c_dram_cell = 20e-15;

                //LP-DRAM wordline transistor parameters
                curr_vpp = 1.5;
                t_ox[3] = 2.1e-3;
                v_th[3] = 0.44559;
                c_ox[3] = 1.41e-14;
                mobility_eff[3] =   426.30 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.181;
                c_g_ideal[3] = 1.10e-15;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 456e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.65;
                n_to_p_eff_curr_drv_ratio[3] = 2.05;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 2.54e-11;
                I_off_n[3][10] = 3.94e-11;
                I_off_n[3][20] = 5.95e-11;
                I_off_n[3][30] = 8.79e-11;
                I_off_n[3][40] = 1.27e-10;
                I_off_n[3][50] = 1.79e-10;
                I_off_n[3][60] = 2.47e-10;
                I_off_n[3][70] = 3.31e-10;
                I_off_n[3][80] = 4.26e-10;
                I_off_n[3][90] = 5.27e-10;
                I_off_n[3][100] = 6.46e-10;
            } else if (ram_cell_tech_type == comm_dram) {
                //COMM-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.1;
                Lphy[3] = 0.045;
                Lelec[3] = 0.0298;
                curr_v_th_dram_access_transistor = 1;
                width_dram_access_transistor = 0.045;
                curr_I_on_dram_cell = 20e-6;//A
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram  = 0;
                curr_area_cell_dram = 6 * 0.045 * 0.045;
                curr_asp_ratio_cell_dram = 1.5;
                curr_c_dram_cell = 30e-15;

                //COMM-DRAM wordline transistor parameters
                curr_vpp = 2.7;
                t_ox[3] = 4e-3;
                v_th[3] = 1.0;
                c_ox[3] = 7.98e-15;
                mobility_eff[3] = 368.58 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.147;
                c_g_ideal[3] = 3.59e-16;
                c_fringe[3] = 0.08e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 999.4e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.69;
                n_to_p_eff_curr_drv_ratio[3] = 1.95;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 1.31e-14;
                I_off_n[3][10] = 2.68e-14;
                I_off_n[3][20] = 5.25e-14;
                I_off_n[3][30] = 9.88e-14;
                I_off_n[3][40] = 1.79e-13;
                I_off_n[3][50] = 3.15e-13;
                I_off_n[3][60] = 5.36e-13;
                I_off_n[3][70] = 8.86e-13;
                I_off_n[3][80] = 1.42e-12;
                I_off_n[3][90] = 2.20e-12;
                I_off_n[3][100] = 3.29e-12;
            }


            //SRAM cell properties
            curr_Wmemcella_sram = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_cam = 2.92;
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff = 0.7 * 0.7;
            curr_core_tx_density      = 1.25;
            curr_sckt_co_eff           = 1.1387;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
        }

        if (tech == 32) {
            SENSE_AMP_D = .03e-9; // s
            SENSE_AMP_P = 2.16e-15; // J
            //For 2013, MPU/ASIC stagger-contacted M1 half-pitch is 32 nm (so this is 32 nm
            //technology i.e. FEATURESIZE = 0.032). Using the SOI process numbers for
            //HP and LSTP.
            vdd[0] = 0.9;
            Lphy[0] = 0.013;
            Lelec[0] = 0.01013;
            t_ox[0] = 0.5e-3;
            v_th[0] = 0.21835;
            c_ox[0] = 4.11e-14;
            mobility_eff[0] = 361.84 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[0] = 5.09E-2;
            c_g_ideal[0] = 5.34e-16;
            c_fringe[0] = 0.04e-15;
            c_junc[0] = 1e-15;
            I_on_n[0] =  2211.7e-6;
            I_on_p[0] = I_on_n[0] / 2;
            nmos_effective_resistance_multiplier = 1.49;
            n_to_p_eff_curr_drv_ratio[0] = 2.41;
            gmp_to_gmn_multiplier[0] = 1.38;
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
            long_channel_leakage_reduction[0] = 1 / 3.706;
            //Using MASTAR, @300K (380K does not work in MASTAR), increase Lgate until Ion reduces to 95% or Lgate increase by 5% (DG device can only increase by 5%),
            //whichever comes first
            I_off_n[0][0] = 1.52e-7;
            I_off_n[0][10] = 1.55e-7;
            I_off_n[0][20] = 1.59e-7;
            I_off_n[0][30] = 1.68e-7;
            I_off_n[0][40] = 1.90e-7;
            I_off_n[0][50] = 2.69e-7;
            I_off_n[0][60] = 5.32e-7;
            I_off_n[0][70] = 1.02e-6;
            I_off_n[0][80] = 1.62e-6;
            I_off_n[0][90] = 2.73e-6;
            I_off_n[0][100] = 6.1e-6;

            I_g_on_n[0][0]  = 6.55e-8;//A/micron
            I_g_on_n[0][10] = 6.55e-8;
            I_g_on_n[0][20] = 6.55e-8;
            I_g_on_n[0][30] = 6.55e-8;
            I_g_on_n[0][40] = 6.55e-8;
            I_g_on_n[0][50] = 6.55e-8;
            I_g_on_n[0][60] = 6.55e-8;
            I_g_on_n[0][70] = 6.55e-8;
            I_g_on_n[0][80] = 6.55e-8;
            I_g_on_n[0][90] = 6.55e-8;
            I_g_on_n[0][100] = 6.55e-8;

            //LSTP device type
            vdd[1] = 1;
            Lphy[1] = 0.020;
            Lelec[1] = 0.0173;
            t_ox[1] = 1.2e-3;
            v_th[1] = 0.513;
            c_ox[1] = 2.29e-14;
            mobility_eff[1] =  347.46 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[1] = 8.64e-2;
            c_g_ideal[1] = 4.58e-16;
            c_fringe[1] = 0.053e-15;
            c_junc[1] = 1e-15;
            I_on_n[1] = 683.6e-6;
            I_on_p[1] = I_on_n[1] / 2;
            nmos_effective_resistance_multiplier = 1.99;
            n_to_p_eff_curr_drv_ratio[1] = 2.23;
            gmp_to_gmn_multiplier[1] = 0.99;
            Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];
            Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];
            long_channel_leakage_reduction[1] = 1 / 1.93;
            I_off_n[1][0] = 2.06e-11;
            I_off_n[1][10] = 3.30e-11;
            I_off_n[1][20] = 5.15e-11;
            I_off_n[1][30] = 7.83e-11;
            I_off_n[1][40] = 1.16e-10;
            I_off_n[1][50] = 1.69e-10;
            I_off_n[1][60] = 2.40e-10;
            I_off_n[1][70] = 3.34e-10;
            I_off_n[1][80] = 4.54e-10;
            I_off_n[1][90] = 5.96e-10;
            I_off_n[1][100] = 7.44e-10;

            I_g_on_n[1][0]  = 3.73e-11;//A/micron
            I_g_on_n[1][10] = 3.73e-11;
            I_g_on_n[1][20] = 3.73e-11;
            I_g_on_n[1][30] = 3.73e-11;
            I_g_on_n[1][40] = 3.73e-11;
            I_g_on_n[1][50] = 3.73e-11;
            I_g_on_n[1][60] = 3.73e-11;
            I_g_on_n[1][70] = 3.73e-11;
            I_g_on_n[1][80] = 3.73e-11;
            I_g_on_n[1][90] = 3.73e-11;
            I_g_on_n[1][100] = 3.73e-11;

            //LOP device type
            vdd[2] = 0.6;
            Lphy[2] = 0.016;
            Lelec[2] = 0.01232;
            t_ox[2] = 0.9e-3;
            v_th[2] = 0.24227;
            c_ox[2] = 2.84e-14;
            mobility_eff[2] =  513.52 * (1e-2 * 1e6 * 1e-2 * 1e6);
            Vdsat[2] = 4.64e-2;
            c_g_ideal[2] = 4.54e-16;
            c_fringe[2] = 0.057e-15;
            c_junc[2] = 1e-15;
            I_on_n[2] = 827.8e-6;
            I_on_p[2] = I_on_n[2] / 2;
            nmos_effective_resistance_multiplier = 1.73;
            n_to_p_eff_curr_drv_ratio[2] = 2.28;
            gmp_to_gmn_multiplier[2] = 1.11;
            Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];
            Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];
            long_channel_leakage_reduction[2] = 1 / 1.89;
            I_off_n[2][0] = 5.94e-8;
            I_off_n[2][10] = 7.23e-8;
            I_off_n[2][20] = 8.7e-8;
            I_off_n[2][30] = 1.04e-7;
            I_off_n[2][40] = 1.22e-7;
            I_off_n[2][50] = 1.43e-7;
            I_off_n[2][60] = 1.65e-7;
            I_off_n[2][70] = 1.90e-7;
            I_off_n[2][80] = 2.15e-7;
            I_off_n[2][90] = 2.39e-7;
            I_off_n[2][100] = 2.63e-7;

            I_g_on_n[2][0]  = 2.93e-9;//A/micron
            I_g_on_n[2][10] = 2.93e-9;
            I_g_on_n[2][20] = 2.93e-9;
            I_g_on_n[2][30] = 2.93e-9;
            I_g_on_n[2][40] = 2.93e-9;
            I_g_on_n[2][50] = 2.93e-9;
            I_g_on_n[2][60] = 2.93e-9;
            I_g_on_n[2][70] = 2.93e-9;
            I_g_on_n[2][80] = 2.93e-9;
            I_g_on_n[2][90] = 2.93e-9;
            I_g_on_n[2][100] = 2.93e-9;

            if (ram_cell_tech_type == lp_dram) {
                //LP-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.0;
                Lphy[3] = 0.056;
                Lelec[3] = 0.0419;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
                curr_v_th_dram_access_transistor = 0.44129;
                width_dram_access_transistor = 0.056;
                curr_I_on_dram_cell = 36e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 18.9e-12;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = width_dram_access_transistor * Lphy[3] * 10.0;
                curr_asp_ratio_cell_dram = 1.46;
                curr_c_dram_cell = 20e-15;

                //LP-DRAM wordline transistor parameters
                curr_vpp = 1.5;
                t_ox[3] = 2e-3;
                v_th[3] = 0.44467;
                c_ox[3] = 1.48e-14;
                mobility_eff[3] =  408.12 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.174;
                c_g_ideal[3] = 7.45e-16;
                c_fringe[3] = 0.053e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 1055.4e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.65;
                n_to_p_eff_curr_drv_ratio[3] = 2.05;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0]  = 3.57e-11;
                I_off_n[3][10] = 5.51e-11;
                I_off_n[3][20] = 8.27e-11;
                I_off_n[3][30] = 1.21e-10;
                I_off_n[3][40] = 1.74e-10;
                I_off_n[3][50] = 2.45e-10;
                I_off_n[3][60] = 3.38e-10;
                I_off_n[3][70] = 4.53e-10;
                I_off_n[3][80] = 5.87e-10;
                I_off_n[3][90] = 7.29e-10;
                I_off_n[3][100] = 8.87e-10;
            } else if (ram_cell_tech_type == comm_dram) {
                //COMM-DRAM cell access transistor technology parameters
                curr_vdd_dram_cell = 1.0;
                Lphy[3] = 0.032;
                Lelec[3] = 0.0205;//Assume Lelec is 30% lesser than Lphy for DRAM access and wordline transistors.
                curr_v_th_dram_access_transistor = 1;
                width_dram_access_transistor = 0.032;
                curr_I_on_dram_cell = 20e-6;
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 6 * 0.032 * 0.032;
                curr_asp_ratio_cell_dram = 1.5;
                curr_c_dram_cell = 30e-15;

                //COMM-DRAM wordline transistor parameters
                curr_vpp = 2.6;
                t_ox[3] = 4e-3;
                v_th[3] = 1.0;
                c_ox[3] = 7.99e-15;
                mobility_eff[3] =  380.76 * (1e-2 * 1e6 * 1e-2 * 1e6);
                Vdsat[3] = 0.129;
                c_g_ideal[3] = 2.56e-16;
                c_fringe[3] = 0.053e-15;
                c_junc[3] = 1e-15;
                I_on_n[3] = 1024.5e-6;
                I_on_p[3] = I_on_n[3] / 2;
                nmos_effective_resistance_multiplier = 1.69;
                n_to_p_eff_curr_drv_ratio[3] = 1.95;
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp / I_on_n[3];
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0]  = 3.63e-14;
                I_off_n[3][10] = 7.18e-14;
                I_off_n[3][20] = 1.36e-13;
                I_off_n[3][30] = 2.49e-13;
                I_off_n[3][40] = 4.41e-13;
                I_off_n[3][50] = 7.55e-13;
                I_off_n[3][60] = 1.26e-12;
                I_off_n[3][70] = 2.03e-12;
                I_off_n[3][80] = 3.19e-12;
                I_off_n[3][90] = 4.87e-12;
                I_off_n[3][100] = 7.16e-12;
            }

            //SRAM cell properties
            curr_Wmemcella_sram    = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram    = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_cam = 2.92;
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7;
            curr_core_tx_density      = 1.25 / 0.7;
            curr_sckt_co_eff           = 1.1111;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
        }

        if (tech == 22) {
            SENSE_AMP_D = .03e-9; // s
            SENSE_AMP_P = 2.16e-15; // J
            //For 2016, MPU/ASIC stagger-contacted M1 half-pitch is 22 nm (so this is 22 nm
            //technology i.e. FEATURESIZE = 0.022). Using the DG process numbers for HP.
            //22 nm HP
            vdd[0] = 0.8;
            Lphy[0] = 0.009;//Lphy is the physical gate-length.
            Lelec[0] = 0.00468;//Lelec is the electrical gate-length.
            t_ox[0] = 0.55e-3;//micron
            v_th[0] = 0.1395;//V
            c_ox[0] = 3.63e-14;//F/micron2
            mobility_eff[0] = 426.07 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[0] = 2.33e-2; //V/micron
            c_g_ideal[0] = 3.27e-16;//F/micron
            c_fringe[0] = 0.06e-15;//F/micron
            c_junc[0] = 0;//F/micron2
            I_on_n[0] =  2626.4e-6;//A/micron
            I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
            nmos_effective_resistance_multiplier = 1.45;
            n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
            //"Dynamic" tab of Device workspace.
            gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
            long_channel_leakage_reduction[0] = 1 / 3.274;
            //From 22nm, leakage current are directly from ITRS report rather
            //than MASTAR, since MASTAR has serious bugs there.
            I_off_n[0][0] = 1.52e-7 / 1.5 * 1.2;
            I_off_n[0][10] = 1.55e-7 / 1.5 * 1.2;
            I_off_n[0][20] = 1.59e-7 / 1.5 * 1.2;
            I_off_n[0][30] = 1.68e-7 / 1.5 * 1.2;
            I_off_n[0][40] = 1.90e-7 / 1.5 * 1.2;
            I_off_n[0][50] = 2.69e-7 / 1.5 * 1.2;
            I_off_n[0][60] = 5.32e-7 / 1.5 * 1.2;
            I_off_n[0][70] = 1.02e-6 / 1.5 * 1.2;
            I_off_n[0][80] = 1.62e-6 / 1.5 * 1.2;
            I_off_n[0][90] = 2.73e-6 / 1.5 * 1.2;
            I_off_n[0][100] = 6.1e-6 / 1.5 * 1.2;
            //for 22nm DG HP
            I_g_on_n[0][0]  = 1.81e-9;//A/micron
            I_g_on_n[0][10] = 1.81e-9;
            I_g_on_n[0][20] = 1.81e-9;
            I_g_on_n[0][30] = 1.81e-9;
            I_g_on_n[0][40] = 1.81e-9;
            I_g_on_n[0][50] = 1.81e-9;
            I_g_on_n[0][60] = 1.81e-9;
            I_g_on_n[0][70] = 1.81e-9;
            I_g_on_n[0][80] = 1.81e-9;
            I_g_on_n[0][90] = 1.81e-9;
            I_g_on_n[0][100] = 1.81e-9;

            //22 nm LSTP DG
            vdd[1] = 0.8;
            Lphy[1] = 0.014;
            Lelec[1] = 0.008;//Lelec is the electrical gate-length.
            t_ox[1] = 1.1e-3;//micron
            v_th[1] = 0.40126;//V
            c_ox[1] = 2.30e-14;//F/micron2
            mobility_eff[1] =  738.09 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[1] = 6.64e-2; //V/micron
            c_g_ideal[1] = 3.22e-16;//F/micron
            c_fringe[1] = 0.08e-15;
            c_junc[1] = 0;//F/micron2
            I_on_n[1] = 727.6e-6;//A/micron
            I_on_p[1] = I_on_n[1] / 2;
            nmos_effective_resistance_multiplier = 1.99;
            n_to_p_eff_curr_drv_ratio[1] = 2;
            gmp_to_gmn_multiplier[1] = 0.99;
            Rnchannelon[1] = nmos_effective_resistance_multiplier * vdd[1] / I_on_n[1];//ohm-micron
            Rpchannelon[1] = n_to_p_eff_curr_drv_ratio[1] * Rnchannelon[1];//ohm-micron
            long_channel_leakage_reduction[1] = 1 / 1.89;
            I_off_n[1][0] = 2.43e-11;
            I_off_n[1][10] = 4.85e-11;
            I_off_n[1][20] = 9.68e-11;
            I_off_n[1][30] = 1.94e-10;
            I_off_n[1][40] = 3.87e-10;
            I_off_n[1][50] = 7.73e-10;
            I_off_n[1][60] = 3.55e-10;
            I_off_n[1][70] = 3.09e-9;
            I_off_n[1][80] = 6.19e-9;
            I_off_n[1][90] = 1.24e-8;
            I_off_n[1][100] = 2.48e-8;

            I_g_on_n[1][0]  = 4.51e-10;//A/micron
            I_g_on_n[1][10] = 4.51e-10;
            I_g_on_n[1][20] = 4.51e-10;
            I_g_on_n[1][30] = 4.51e-10;
            I_g_on_n[1][40] = 4.51e-10;
            I_g_on_n[1][50] = 4.51e-10;
            I_g_on_n[1][60] = 4.51e-10;
            I_g_on_n[1][70] = 4.51e-10;
            I_g_on_n[1][80] = 4.51e-10;
            I_g_on_n[1][90] = 4.51e-10;
            I_g_on_n[1][100] = 4.51e-10;

            //22 nm LOP
            vdd[2] = 0.6;
            Lphy[2] = 0.011;
            Lelec[2] = 0.00604;//Lelec is the electrical gate-length.
            t_ox[2] = 0.8e-3;//micron
            v_th[2] = 0.2315;//V
            c_ox[2] = 2.87e-14;//F/micron2
            mobility_eff[2] =  698.37 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[2] = 1.81e-2; //V/micron
            c_g_ideal[2] = 3.16e-16;//F/micron
            c_fringe[2] = 0.08e-15;
            c_junc[2] = 0;//F/micron2 This is Cj0 not Cjunc in MASTAR results->Dynamic Tab
            I_on_n[2] = 916.1e-6;//A/micron
            I_on_p[2] = I_on_n[2] / 2;
            nmos_effective_resistance_multiplier = 1.73;
            n_to_p_eff_curr_drv_ratio[2] = 2;
            gmp_to_gmn_multiplier[2] = 1.11;
            Rnchannelon[2] = nmos_effective_resistance_multiplier * vdd[2] / I_on_n[2];//ohm-micron
            Rpchannelon[2] = n_to_p_eff_curr_drv_ratio[2] * Rnchannelon[2];//ohm-micron
            long_channel_leakage_reduction[2] = 1 / 2.38;

            I_off_n[2][0] = 1.31e-8;
            I_off_n[2][10] = 2.60e-8;
            I_off_n[2][20] = 5.14e-8;
            I_off_n[2][30] = 1.02e-7;
            I_off_n[2][40] = 2.02e-7;
            I_off_n[2][50] = 3.99e-7;
            I_off_n[2][60] = 7.91e-7;
            I_off_n[2][70] = 1.09e-6;
            I_off_n[2][80] = 2.09e-6;
            I_off_n[2][90] = 4.04e-6;
            I_off_n[2][100] = 4.48e-6;

            I_g_on_n[2][0]  = 2.74e-9;//A/micron
            I_g_on_n[2][10] = 2.74e-9;
            I_g_on_n[2][20] = 2.74e-9;
            I_g_on_n[2][30] = 2.74e-9;
            I_g_on_n[2][40] = 2.74e-9;
            I_g_on_n[2][50] = 2.74e-9;
            I_g_on_n[2][60] = 2.74e-9;
            I_g_on_n[2][70] = 2.74e-9;
            I_g_on_n[2][80] = 2.74e-9;
            I_g_on_n[2][90] = 2.74e-9;
            I_g_on_n[2][100] = 2.74e-9;


            if (ram_cell_tech_type == 3) {} else if (ram_cell_tech_type == 4) {
                //22 nm commodity DRAM cell access transistor technology parameters.
                //parameters
                curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
                //2005 ITRS, the value was about twice the value in 2007 ITRS
                Lphy[3] = 0.022;//micron
                Lelec[3] = 0.0181;//micron.
                curr_v_th_dram_access_transistor = 1;//V
                width_dram_access_transistor = 0.022;//micron
                curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
                //kept constant. In reality this could perhaps be lower
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 6 * 0.022 * 0.022;//micron2.
                curr_asp_ratio_cell_dram = 0.667;
                curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
                //kept constant.

                //22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
                curr_vpp = 2.3;//vpp. V
                t_ox[3] = 3.5e-3;//micron
                v_th[3] = 1.0;//V
                c_ox[3] = 9.06e-15;//F/micron2
                mobility_eff[3] =  367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
                Vdsat[3] = 0.0972; //V/micron
                c_g_ideal[3] = 1.99e-16;//F/micron
                c_fringe[3] = 0.053e-15;//F/micron
                c_junc[3] = 1e-15;//F/micron2
                I_on_n[3] = 910.5e-6;//A/micron
                I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
                nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
                //
                n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp  / I_on_n[3];//ohm-micron
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 1.1e-13; //A/micron
                I_off_n[3][10] = 2.11e-13;
                I_off_n[3][20] = 3.88e-13;
                I_off_n[3][30] = 6.9e-13;
                I_off_n[3][40] = 1.19e-12;
                I_off_n[3][50] = 1.98e-12;
                I_off_n[3][60] = 3.22e-12;
                I_off_n[3][70] = 5.09e-12;
                I_off_n[3][80] = 7.85e-12;
                I_off_n[3][90] = 1.18e-11;
                I_off_n[3][100] = 1.72e-11;

            } else {
                //some error handler
            }

            //SRAM cell properties
            curr_Wmemcella_sram    = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram    = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_cam = 2.92;
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7 * 0.7;
            curr_core_tx_density      = 1.25 / 0.7 / 0.7;
            curr_sckt_co_eff           = 1.1296;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
        }

        if (tech == 16) {
            //For 2019, MPU/ASIC stagger-contacted M1 half-pitch is 16 nm (so this is 16 nm
            //technology i.e. FEATURESIZE = 0.016). Using the DG process numbers for HP.
            //16 nm HP
            vdd[0] = 0.7;
            Lphy[0] = 0.006;//Lphy is the physical gate-length.
            Lelec[0] = 0.00315;//Lelec is the electrical gate-length.
            t_ox[0] = 0.5e-3;//micron
            v_th[0] = 0.1489;//V
            c_ox[0] = 3.83e-14;//F/micron2 Cox_elec in MASTAR
            mobility_eff[0] = 476.15 * (1e-2 * 1e6 * 1e-2 * 1e6); //micron2 / Vs
            Vdsat[0] = 1.42e-2; //V/micron calculated in spreadsheet
            c_g_ideal[0] = 2.30e-16;//F/micron
            c_fringe[0] = 0.06e-15;//F/micron MASTAR inputdynamic/3
            c_junc[0] = 0;//F/micron2 MASTAR result dynamic
            I_on_n[0] =  2768.4e-6;//A/micron
            I_on_p[0] = I_on_n[0] / 2;//A/micron //This value for I_on_p is not really used.
            nmos_effective_resistance_multiplier = 1.48;//nmos_effective_resistance_multiplier  is the ratio of Ieff to Idsat where Ieff is the effective NMOS current and Idsat is the saturation current.
            n_to_p_eff_curr_drv_ratio[0] = 2; //Wpmos/Wnmos = 2 in 2007 MASTAR. Look in
            //"Dynamic" tab of Device workspace.
            gmp_to_gmn_multiplier[0] = 1.38; //Just using the 32nm SOI value.
            Rnchannelon[0] = nmos_effective_resistance_multiplier * vdd[0] / I_on_n[0];//ohm-micron
            Rpchannelon[0] = n_to_p_eff_curr_drv_ratio[0] * Rnchannelon[0];//ohm-micron
            long_channel_leakage_reduction[0] = 1 / 2.655;
            I_off_n[0][0] = 1.52e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][10] = 1.55e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][20] = 1.59e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][30] = 1.68e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][40] = 1.90e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][50] = 2.69e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][60] = 5.32e-7 / 1.5 * 1.2 * 1.07;
            I_off_n[0][70] = 1.02e-6 / 1.5 * 1.2 * 1.07;
            I_off_n[0][80] = 1.62e-6 / 1.5 * 1.2 * 1.07;
            I_off_n[0][90] = 2.73e-6 / 1.5 * 1.2 * 1.07;
            I_off_n[0][100] = 6.1e-6 / 1.5 * 1.2 * 1.07;
            //for 16nm DG HP
            I_g_on_n[0][0]  = 1.07e-9;//A/micron
            I_g_on_n[0][10] = 1.07e-9;
            I_g_on_n[0][20] = 1.07e-9;
            I_g_on_n[0][30] = 1.07e-9;
            I_g_on_n[0][40] = 1.07e-9;
            I_g_on_n[0][50] = 1.07e-9;
            I_g_on_n[0][60] = 1.07e-9;
            I_g_on_n[0][70] = 1.07e-9;
            I_g_on_n[0][80] = 1.07e-9;
            I_g_on_n[0][90] = 1.07e-9;
            I_g_on_n[0][100] = 1.07e-9;

            if (ram_cell_tech_type == 3) {} else if (ram_cell_tech_type == 4) {
                //22 nm commodity DRAM cell access transistor technology parameters.
                //parameters
                curr_vdd_dram_cell = 0.9;//0.45;//This value has reduced greatly in 2007 ITRS for all technology nodes. In
                //2005 ITRS, the value was about twice the value in 2007 ITRS
                Lphy[3] = 0.022;//micron
                Lelec[3] = 0.0181;//micron.
                curr_v_th_dram_access_transistor = 1;//V
                width_dram_access_transistor = 0.022;//micron
                curr_I_on_dram_cell = 20e-6; //This is a typical value that I have always
                //kept constant. In reality this could perhaps be lower
                curr_I_off_dram_cell_worst_case_length_temp = 1e-15;//A
                curr_Wmemcella_dram = width_dram_access_transistor;
                curr_Wmemcellpmos_dram = 0;
                curr_Wmemcellnmos_dram = 0;
                curr_area_cell_dram = 6 * 0.022 * 0.022;//micron2.
                curr_asp_ratio_cell_dram = 0.667;
                curr_c_dram_cell = 30e-15;//This is a typical value that I have alwaus
                //kept constant.

                //22 nm commodity DRAM wordline transistor parameters obtained using MASTAR.
                curr_vpp = 2.3;//vpp. V
                t_ox[3] = 3.5e-3;//micron
                v_th[3] = 1.0;//V
                c_ox[3] = 9.06e-15;//F/micron2
                mobility_eff[3] =  367.29 * (1e-2 * 1e6 * 1e-2 * 1e6);//micron2 / Vs
                Vdsat[3] = 0.0972; //V/micron
                c_g_ideal[3] = 1.99e-16;//F/micron
                c_fringe[3] = 0.053e-15;//F/micron
                c_junc[3] = 1e-15;//F/micron2
                I_on_n[3] = 910.5e-6;//A/micron
                I_on_p[3] = I_on_n[3] / 2;//This value for I_on_p is not really used.
                nmos_effective_resistance_multiplier = 1.69;//Using the value from 32nm.
                //
                n_to_p_eff_curr_drv_ratio[3] = 1.95;//Using the value from 32nm
                gmp_to_gmn_multiplier[3] = 0.90;
                Rnchannelon[3] = nmos_effective_resistance_multiplier * curr_vpp  / I_on_n[3];//ohm-micron
                Rpchannelon[3] = n_to_p_eff_curr_drv_ratio[3] * Rnchannelon[3];//ohm-micron
                long_channel_leakage_reduction[3] = 1;
                I_off_n[3][0] = 1.1e-13; //A/micron
                I_off_n[3][10] = 2.11e-13;
                I_off_n[3][20] = 3.88e-13;
                I_off_n[3][30] = 6.9e-13;
                I_off_n[3][40] = 1.19e-12;
                I_off_n[3][50] = 1.98e-12;
                I_off_n[3][60] = 3.22e-12;
                I_off_n[3][70] = 5.09e-12;
                I_off_n[3][80] = 7.85e-12;
                I_off_n[3][90] = 1.18e-11;
                I_off_n[3][100] = 1.72e-11;

            } else {
                //some error handler
            }

            //SRAM cell properties
            curr_Wmemcella_sram    = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_sram = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_sram = 2.08 * g_ip->F_sz_um;
            curr_area_cell_sram    = 146 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_sram = 1.46;
            //CAM cell properties //TODO: data need to be revisited
            curr_Wmemcella_cam = 1.31 * g_ip->F_sz_um;
            curr_Wmemcellpmos_cam = 1.23 * g_ip->F_sz_um;
            curr_Wmemcellnmos_cam = 2.08 * g_ip->F_sz_um;
            curr_area_cell_cam = 292 * g_ip->F_sz_um * g_ip->F_sz_um;
            curr_asp_ratio_cell_cam = 2.92;
            //Empirical undifferetiated core/FU coefficient
            curr_logic_scaling_co_eff = 0.7 * 0.7 * 0.7 * 0.7 * 0.7;
            curr_core_tx_density      = 1.25 / 0.7 / 0.7 / 0.7;
            curr_sckt_co_eff           = 1.1296;
            curr_chip_layout_overhead  = 1.2;//die measurement results based on Niagara 1 and 2
            curr_macro_layout_overhead = 1.1;//EDA placement and routing tool rule of thumb
        }


        g_tp.peri_global.Vdd       += curr_alpha * vdd[peri_global_tech_type];
        g_tp.peri_global.t_ox      += curr_alpha * t_ox[peri_global_tech_type];
        g_tp.peri_global.Vth       += curr_alpha * v_th[peri_global_tech_type];
        g_tp.peri_global.C_ox      += curr_alpha * c_ox[peri_global_tech_type];
        g_tp.peri_global.C_g_ideal += curr_alpha * c_g_ideal[peri_global_tech_type];
        g_tp.peri_global.C_fringe  += curr_alpha * c_fringe[peri_global_tech_type];
        g_tp.peri_global.C_junc    += curr_alpha * c_junc[peri_global_tech_type];
        g_tp.peri_global.C_junc_sidewall = 0.25e-15;  // F/micron
        g_tp.peri_global.l_phy     += curr_alpha * Lphy[peri_global_tech_type];
        g_tp.peri_global.l_elec    += curr_alpha * Lelec[peri_global_tech_type];
        g_tp.peri_global.I_on_n    += curr_alpha * I_on_n[peri_global_tech_type];
        g_tp.peri_global.R_nch_on  += curr_alpha * Rnchannelon[peri_global_tech_type];
        g_tp.peri_global.R_pch_on  += curr_alpha * Rpchannelon[peri_global_tech_type];
        g_tp.peri_global.n_to_p_eff_curr_drv_ratio
        += curr_alpha * n_to_p_eff_curr_drv_ratio[peri_global_tech_type];
        g_tp.peri_global.long_channel_leakage_reduction
        += curr_alpha * long_channel_leakage_reduction[peri_global_tech_type];
        g_tp.peri_global.I_off_n   += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
        g_tp.peri_global.I_off_p   += curr_alpha * I_off_n[peri_global_tech_type][g_ip->temp - 300];
        g_tp.peri_global.I_g_on_n   += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
        g_tp.peri_global.I_g_on_p   += curr_alpha * I_g_on_n[peri_global_tech_type][g_ip->temp - 300];
        gmp_to_gmn_multiplier_periph_global += curr_alpha * gmp_to_gmn_multiplier[peri_global_tech_type];

        g_tp.sram_cell.Vdd       += curr_alpha * vdd[ram_cell_tech_type];
        g_tp.sram_cell.l_phy     += curr_alpha * Lphy[ram_cell_tech_type];
        g_tp.sram_cell.l_elec    += curr_alpha * Lelec[ram_cell_tech_type];
        g_tp.sram_cell.t_ox      += curr_alpha * t_ox[ram_cell_tech_type];
        g_tp.sram_cell.Vth       += curr_alpha * v_th[ram_cell_tech_type];
        g_tp.sram_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
        g_tp.sram_cell.C_fringe  += curr_alpha * c_fringe[ram_cell_tech_type];
        g_tp.sram_cell.C_junc    += curr_alpha * c_junc[ram_cell_tech_type];
        g_tp.sram_cell.C_junc_sidewall = 0.25e-15;  // F/micron
        g_tp.sram_cell.I_on_n    += curr_alpha * I_on_n[ram_cell_tech_type];
        g_tp.sram_cell.R_nch_on  += curr_alpha * Rnchannelon[ram_cell_tech_type];
        g_tp.sram_cell.R_pch_on  += curr_alpha * Rpchannelon[ram_cell_tech_type];
        g_tp.sram_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
        g_tp.sram_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
        g_tp.sram_cell.I_off_n   += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.sram_cell.I_off_p   += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.sram_cell.I_g_on_n   += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.sram_cell.I_g_on_p   += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];

        g_tp.dram_cell_Vdd      += curr_alpha * curr_vdd_dram_cell;
        g_tp.dram_acc.Vth       += curr_alpha * curr_v_th_dram_access_transistor;
        g_tp.dram_acc.l_phy     += curr_alpha * Lphy[dram_cell_tech_flavor];
        g_tp.dram_acc.l_elec    += curr_alpha * Lelec[dram_cell_tech_flavor];
        g_tp.dram_acc.C_g_ideal += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
        g_tp.dram_acc.C_fringe  += curr_alpha * c_fringe[dram_cell_tech_flavor];
        g_tp.dram_acc.C_junc    += curr_alpha * c_junc[dram_cell_tech_flavor];
        g_tp.dram_acc.C_junc_sidewall = 0.25e-15;  // F/micron
        g_tp.dram_cell_I_on     += curr_alpha * curr_I_on_dram_cell;
        g_tp.dram_cell_I_off_worst_case_len_temp += curr_alpha * curr_I_off_dram_cell_worst_case_length_temp;
        g_tp.dram_acc.I_on_n    += curr_alpha * I_on_n[dram_cell_tech_flavor];
        g_tp.dram_cell_C        += curr_alpha * curr_c_dram_cell;
        g_tp.vpp                += curr_alpha * curr_vpp;
        g_tp.dram_wl.l_phy      += curr_alpha * Lphy[dram_cell_tech_flavor];
        g_tp.dram_wl.l_elec     += curr_alpha * Lelec[dram_cell_tech_flavor];
        g_tp.dram_wl.C_g_ideal  += curr_alpha * c_g_ideal[dram_cell_tech_flavor];
        g_tp.dram_wl.C_fringe   += curr_alpha * c_fringe[dram_cell_tech_flavor];
        g_tp.dram_wl.C_junc     += curr_alpha * c_junc[dram_cell_tech_flavor];
        g_tp.dram_wl.C_junc_sidewall = 0.25e-15;  // F/micron
        g_tp.dram_wl.I_on_n     += curr_alpha * I_on_n[dram_cell_tech_flavor];
        g_tp.dram_wl.R_nch_on   += curr_alpha * Rnchannelon[dram_cell_tech_flavor];
        g_tp.dram_wl.R_pch_on   += curr_alpha * Rpchannelon[dram_cell_tech_flavor];
        g_tp.dram_wl.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[dram_cell_tech_flavor];
        g_tp.dram_wl.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[dram_cell_tech_flavor];
        g_tp.dram_wl.I_off_n    += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];
        g_tp.dram_wl.I_off_p    += curr_alpha * I_off_n[dram_cell_tech_flavor][g_ip->temp - 300];

        g_tp.cam_cell.Vdd       += curr_alpha * vdd[ram_cell_tech_type];
        g_tp.cam_cell.l_phy     += curr_alpha * Lphy[ram_cell_tech_type];
        g_tp.cam_cell.l_elec    += curr_alpha * Lelec[ram_cell_tech_type];
        g_tp.cam_cell.t_ox      += curr_alpha * t_ox[ram_cell_tech_type];
        g_tp.cam_cell.Vth       += curr_alpha * v_th[ram_cell_tech_type];
        g_tp.cam_cell.C_g_ideal += curr_alpha * c_g_ideal[ram_cell_tech_type];
        g_tp.cam_cell.C_fringe  += curr_alpha * c_fringe[ram_cell_tech_type];
        g_tp.cam_cell.C_junc    += curr_alpha * c_junc[ram_cell_tech_type];
        g_tp.cam_cell.C_junc_sidewall = 0.25e-15;  // F/micron
        g_tp.cam_cell.I_on_n    += curr_alpha * I_on_n[ram_cell_tech_type];
        g_tp.cam_cell.R_nch_on  += curr_alpha * Rnchannelon[ram_cell_tech_type];
        g_tp.cam_cell.R_pch_on  += curr_alpha * Rpchannelon[ram_cell_tech_type];
        g_tp.cam_cell.n_to_p_eff_curr_drv_ratio += curr_alpha * n_to_p_eff_curr_drv_ratio[ram_cell_tech_type];
        g_tp.cam_cell.long_channel_leakage_reduction += curr_alpha * long_channel_leakage_reduction[ram_cell_tech_type];
        g_tp.cam_cell.I_off_n   += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.cam_cell.I_off_p   += curr_alpha * I_off_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.cam_cell.I_g_on_n   += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];
        g_tp.cam_cell.I_g_on_p   += curr_alpha * I_g_on_n[ram_cell_tech_type][g_ip->temp - 300];

        g_tp.dram.cell_a_w    += curr_alpha * curr_Wmemcella_dram;
        g_tp.dram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_dram;
        g_tp.dram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_dram;
        area_cell_dram        += curr_alpha * curr_area_cell_dram;
        asp_ratio_cell_dram   += curr_alpha * curr_asp_ratio_cell_dram;

        g_tp.sram.cell_a_w    += curr_alpha * curr_Wmemcella_sram;
        g_tp.sram.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_sram;
        g_tp.sram.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_sram;
        area_cell_sram += curr_alpha * curr_area_cell_sram;
        asp_ratio_cell_sram += curr_alpha * curr_asp_ratio_cell_sram;

        g_tp.cam.cell_a_w    += curr_alpha * curr_Wmemcella_cam;//sheng
        g_tp.cam.cell_pmos_w += curr_alpha * curr_Wmemcellpmos_cam;
        g_tp.cam.cell_nmos_w += curr_alpha * curr_Wmemcellnmos_cam;
        area_cell_cam += curr_alpha * curr_area_cell_cam;
        asp_ratio_cell_cam += curr_alpha * curr_asp_ratio_cell_cam;

        //Sense amplifier latch Gm calculation
        mobility_eff_periph_global += curr_alpha * mobility_eff[peri_global_tech_type];
        Vdsat_periph_global += curr_alpha * Vdsat[peri_global_tech_type];

        //Empirical undifferetiated core/FU coefficient
        g_tp.scaling_factor.logic_scaling_co_eff += curr_alpha * curr_logic_scaling_co_eff;
        g_tp.scaling_factor.core_tx_density += curr_alpha * curr_core_tx_density;
        g_tp.chip_layout_overhead  += curr_alpha * curr_chip_layout_overhead;
        g_tp.macro_layout_overhead += curr_alpha * curr_macro_layout_overhead;
        g_tp.sckt_co_eff           += curr_alpha * curr_sckt_co_eff;
    }


    //Currently we are not modeling the resistance/capacitance of poly anywhere.
    //Continuous function (or date have been processed) does not need linear interpolation
    g_tp.w_comp_inv_p1 = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
    g_tp.w_comp_inv_n1 =  7.5 * g_ip->F_sz_um;//this was  6 micron for the 0.8 micron process
    g_tp.w_comp_inv_p2 =   25 * g_ip->F_sz_um;//this was 20 micron for the 0.8 micron process
    g_tp.w_comp_inv_n2 =   15 * g_ip->F_sz_um;//this was 12 micron for the 0.8 micron process
    g_tp.w_comp_inv_p3 =   50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
    g_tp.w_comp_inv_n3 =   30 * g_ip->F_sz_um;//this was 24 micron for the 0.8 micron process
    g_tp.w_eval_inv_p  =  100 * g_ip->F_sz_um;//this was 80 micron for the 0.8 micron process
    g_tp.w_eval_inv_n  =   50 * g_ip->F_sz_um;//this was 40 micron for the 0.8 micron process
    g_tp.w_comp_n     = 12.5 * g_ip->F_sz_um;//this was 10 micron for the 0.8 micron process
    g_tp.w_comp_p     = 37.5 * g_ip->F_sz_um;//this was 30 micron for the 0.8 micron process

    g_tp.MIN_GAP_BET_P_AND_N_DIFFS = 5 * g_ip->F_sz_um;
    g_tp.MIN_GAP_BET_SAME_TYPE_DIFFS = 1.5 * g_ip->F_sz_um;
    g_tp.HPOWERRAIL = 2 * g_ip->F_sz_um;
    g_tp.cell_h_def = 50 * g_ip->F_sz_um;
    g_tp.w_poly_contact = g_ip->F_sz_um;
    g_tp.spacing_poly_to_contact = g_ip->F_sz_um;
    g_tp.spacing_poly_to_poly = 1.5 * g_ip->F_sz_um;
    g_tp.ram_wl_stitching_overhead_ = 7.5 * g_ip->F_sz_um;

    g_tp.min_w_nmos_ = 3 * g_ip->F_sz_um / 2;
    g_tp.max_w_nmos_ = 100 * g_ip->F_sz_um;
    //was 10 micron for the 0.8 micron process
    g_tp.w_iso = 12.5 * g_ip->F_sz_um;
    // sense amplifier N-trans; was 3 micron for the 0.8 micron process
    g_tp.w_sense_n = 3.75 * g_ip->F_sz_um;
    // sense amplifier P-trans; was 6 micron for the 0.8 micron process
    g_tp.w_sense_p = 7.5 * g_ip->F_sz_um;
    // Sense enable transistor of the sense amplifier; was 4 micron for the
    //0.8 micron process
    g_tp.w_sense_en = 5 * g_ip->F_sz_um;
    g_tp.w_nmos_b_mux = 6 * g_tp.min_w_nmos_;
    g_tp.w_nmos_sa_mux= 6 * g_tp.min_w_nmos_;

    if (ram_cell_tech_type == comm_dram) {
        g_tp.max_w_nmos_dec = 8 * g_ip->F_sz_um;
        g_tp.h_dec          = 8;  // in the unit of memory cell height
    } else {
        g_tp.max_w_nmos_dec = g_tp.max_w_nmos_;
        g_tp.h_dec          = 4;  // in the unit of memory cell height
    }

    g_tp.peri_global.C_overlap = 0.2 * g_tp.peri_global.C_g_ideal;
    g_tp.sram_cell.C_overlap   = 0.2 * g_tp.sram_cell.C_g_ideal;
    g_tp.cam_cell.C_overlap    = 0.2 * g_tp.cam_cell.C_g_ideal;

    g_tp.dram_acc.C_overlap = 0.2 * g_tp.dram_acc.C_g_ideal;
    g_tp.dram_acc.R_nch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_n;
    //g_tp.dram_acc.R_pch_on = g_tp.dram_cell_Vdd / g_tp.dram_acc.I_on_p;

    g_tp.dram_wl.C_overlap = 0.2 * g_tp.dram_wl.C_g_ideal;

    double gmn_sense_amp_latch = (mobility_eff_periph_global / 2) * g_tp.peri_global.C_ox * (g_tp.w_sense_n / g_tp.peri_global.l_elec) * Vdsat_periph_global;
    double gmp_sense_amp_latch = gmp_to_gmn_multiplier_periph_global * gmn_sense_amp_latch;
    g_tp.gm_sense_amp_latch = gmn_sense_amp_latch + gmp_sense_amp_latch;

    g_tp.dram.b_w = sqrt(area_cell_dram / (asp_ratio_cell_dram));
    g_tp.dram.b_h = asp_ratio_cell_dram * g_tp.dram.b_w;
    g_tp.sram.b_w = sqrt(area_cell_sram / (asp_ratio_cell_sram));
    g_tp.sram.b_h = asp_ratio_cell_sram * g_tp.sram.b_w;
    g_tp.cam.b_w =  sqrt(area_cell_cam / (asp_ratio_cell_cam));//Sheng
    g_tp.cam.b_h = asp_ratio_cell_cam * g_tp.cam.b_w;

    g_tp.dram.Vbitpre = g_tp.dram_cell_Vdd;
    g_tp.sram.Vbitpre = vdd[ram_cell_tech_type];
    g_tp.cam.Vbitpre = vdd[ram_cell_tech_type];//Sheng
    pmos_to_nmos_sizing_r = pmos_to_nmos_sz_ratio();
    g_tp.w_pmos_bl_precharge = 6 * pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;
    g_tp.w_pmos_bl_eq = pmos_to_nmos_sizing_r * g_tp.min_w_nmos_;


    double wire_pitch       [NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    wire_r_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    wire_c_per_micron[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    horiz_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    vert_dielectric_constant[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    aspect_ratio[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    miller_value[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES],
    ild_thickness[NUMBER_INTERCONNECT_PROJECTION_TYPES][NUMBER_WIRE_TYPES];

    for (iter = 0; iter <= 1; ++iter) {
        // linear interpolation
        if (iter == 0) {
            tech = tech_lo;
            if (tech_lo == tech_hi) {
                curr_alpha = 1;
            } else {
                curr_alpha = (technology - tech_hi) / (tech_lo - tech_hi);
            }
        } else {
            tech = tech_hi;
            if (tech_lo == tech_hi) {
                break;
            } else {
                curr_alpha = (tech_lo - technology) / (tech_lo - tech_hi);
            }
        }

        if (tech == 180) {
            //Aggressive projections
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//micron
            aspect_ratio[0][0] = 2.0;
            wire_width = wire_pitch[0][0] / 2; //micron
            wire_thickness = aspect_ratio[0][0] * wire_width;//micron
            wire_spacing = wire_pitch[0][0] - wire_width;//micron
            barrier_thickness = 0.017;//micron
            dishing_thickness = 0;//micron
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);//ohm/micron
            ild_thickness[0][0] = 0.75;//micron
            miller_value[0][0] = 1.5;
            horiz_dielectric_constant[0][0] = 2.709;
            vert_dielectric_constant[0][0] = 3.9;
            fringe_cap = 0.115e-15; //F/micron
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0],
                                      vert_dielectric_constant[0][0],
                                      fringe_cap);//F/micron.

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1] = 2.4;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1] = 0.75;//micron
            miller_value[0][1] = 1.5;
            horiz_dielectric_constant[0][1] = 2.709;
            vert_dielectric_constant[0][1] = 3.9;
            fringe_cap = 0.115e-15; //F/micron
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
                                      vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[0][2] = 2.2;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 1.5;
            miller_value[0][2] = 1.5;
            horiz_dielectric_constant[0][2] = 2.709;
            vert_dielectric_constant[0][2] = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.017;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.75;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 3.038;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0],
                                      vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.75;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 3.038;
            vert_dielectric_constant[1][1] = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1],
                                      vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2]  = 1.98;
            miller_value[1][2]  = 1.5;
            horiz_dielectric_constant[1][2]  = 3.038;
            vert_dielectric_constant[1][2]  = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2] , miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.18;
            wire_c_per_micron[1][3] = 60e-15 / (256 * 2 * 0.18);
            wire_r_per_micron[1][3] = 12 / 0.18;
        } else if (tech == 90) {
            //Aggressive projections
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//micron
            aspect_ratio[0][0] = 2.4;
            wire_width = wire_pitch[0][0] / 2; //micron
            wire_thickness = aspect_ratio[0][0] * wire_width;//micron
            wire_spacing = wire_pitch[0][0] - wire_width;//micron
            barrier_thickness = 0.01;//micron
            dishing_thickness = 0;//micron
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);//ohm/micron
            ild_thickness[0][0] = 0.48;//micron
            miller_value[0][0] = 1.5;
            horiz_dielectric_constant[0][0] = 2.709;
            vert_dielectric_constant[0][0] = 3.9;
            fringe_cap = 0.115e-15; //F/micron
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0],
                                      vert_dielectric_constant[0][0],
                                      fringe_cap);//F/micron.

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1] = 2.4;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1] = 0.48;//micron
            miller_value[0][1] = 1.5;
            horiz_dielectric_constant[0][1] = 2.709;
            vert_dielectric_constant[0][1] = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
                                      vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[0][2] = 2.7;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.96;
            miller_value[0][2] = 1.5;
            horiz_dielectric_constant[0][2] = 2.709;
            vert_dielectric_constant[0][2] = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0]  = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.008;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0]  = 0.48;
            miller_value[1][0]  = 1.5;
            horiz_dielectric_constant[1][0]  = 3.038;
            vert_dielectric_constant[1][0]  = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0],
                                      vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1]  = 0.48;
            miller_value[1][1]  = 1.5;
            horiz_dielectric_constant[1][1]  = 3.038;
            vert_dielectric_constant[1][1]  = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1],
                                      vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2]  = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2]  = 1.1;
            miller_value[1][2]  = 1.5;
            horiz_dielectric_constant[1][2]  = 3.038;
            vert_dielectric_constant[1][2]  = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2] , miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.09;
            wire_c_per_micron[1][3] = 60e-15 / (256 * 2 * 0.09);
            wire_r_per_micron[1][3] = 12 / 0.09;
        } else if (tech == 65) {
            //Aggressive projections
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[0][0]  = 2.7;
            wire_width = wire_pitch[0][0] / 2;
            wire_thickness = aspect_ratio[0][0]  * wire_width;
            wire_spacing = wire_pitch[0][0] - wire_width;
            barrier_thickness = 0;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][0]  = 0.405;
            miller_value[0][0]   = 1.5;
            horiz_dielectric_constant[0][0]  = 2.303;
            vert_dielectric_constant[0][0]   = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
                                      fringe_cap);

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1]  = 2.7;
            wire_thickness = aspect_ratio[0][1]  * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1]  = 0.405;
            miller_value[0][1]   = 1.5;
            horiz_dielectric_constant[0][1]  = 2.303;
            vert_dielectric_constant[0][1]   = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1],
                                      vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[0][2] = 2.8;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.81;
            miller_value[0][2]   = 1.5;
            horiz_dielectric_constant[0][2]  = 2.303;
            vert_dielectric_constant[0][2]   = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.006;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.405;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 2.734;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.405;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 2.734;
            vert_dielectric_constant[1][1] = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2] = 0.77;
            miller_value[1][2] = 1.5;
            horiz_dielectric_constant[1][2] = 2.734;
            vert_dielectric_constant[1][2] = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.065;
            wire_c_per_micron[1][3] = 52.5e-15 / (256 * 2 * 0.065);
            wire_r_per_micron[1][3] = 12 / 0.065;
        } else if (tech == 45) {
            //Aggressive projections.
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[0][0]  = 3.0;
            wire_width = wire_pitch[0][0] / 2;
            wire_thickness = aspect_ratio[0][0]  * wire_width;
            wire_spacing = wire_pitch[0][0] - wire_width;
            barrier_thickness = 0;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][0]  = 0.315;
            miller_value[0][0]  = 1.5;
            horiz_dielectric_constant[0][0]  = 1.958;
            vert_dielectric_constant[0][0]  = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0] , miller_value[0][0] , horiz_dielectric_constant[0][0] , vert_dielectric_constant[0][0] ,
                                      fringe_cap);

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1]  = 3.0;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1]  = 0.315;
            miller_value[0][1]  = 1.5;
            horiz_dielectric_constant[0][1]  = 1.958;
            vert_dielectric_constant[0][1]  = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[0][2] = 3.0;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.63;
            miller_value[0][2]  = 1.5;
            horiz_dielectric_constant[0][2]  = 1.958;
            vert_dielectric_constant[0][2]  = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.004;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.315;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 2.46;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.315;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 2.46;
            vert_dielectric_constant[1][1] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 * wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2] = 0.55;
            miller_value[1][2] = 1.5;
            horiz_dielectric_constant[1][2] = 2.46;
            vert_dielectric_constant[1][2] = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.045;
            wire_c_per_micron[1][3] = 37.5e-15 / (256 * 2 * 0.045);
            wire_r_per_micron[1][3] = 12 / 0.045;
        } else if (tech == 32) {
            //Aggressive projections.
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[0][0] = 3.0;
            wire_width = wire_pitch[0][0] / 2;
            wire_thickness = aspect_ratio[0][0] * wire_width;
            wire_spacing = wire_pitch[0][0] - wire_width;
            barrier_thickness = 0;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][0] = 0.21;
            miller_value[0][0] = 1.5;
            horiz_dielectric_constant[0][0] = 1.664;
            vert_dielectric_constant[0][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
                                      fringe_cap);

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1] = 3.0;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1] = 0.21;
            miller_value[0][1] = 1.5;
            horiz_dielectric_constant[0][1] = 1.664;
            vert_dielectric_constant[0][1] = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[0][2] = 3.0;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.42;
            miller_value[0][2] = 1.5;
            horiz_dielectric_constant[0][2] = 1.664;
            vert_dielectric_constant[0][2] = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.003;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.21;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 2.214;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            aspect_ratio[1][1] = 2.0;
            wire_width = wire_pitch[1][1] / 2;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.21;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 2.214;
            vert_dielectric_constant[1][1] = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2] = 0.385;
            miller_value[1][2] = 1.5;
            horiz_dielectric_constant[1][2] = 2.214;
            vert_dielectric_constant[1][2] = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.032;//micron
            wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.032);//F/micron
            wire_r_per_micron[1][3] = 12 / 0.032;//ohm/micron
        } else if (tech == 22) {
            //Aggressive projections.
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
            aspect_ratio[0][0] = 3.0;
            wire_width = wire_pitch[0][0] / 2;
            wire_thickness = aspect_ratio[0][0] * wire_width;
            wire_spacing = wire_pitch[0][0] - wire_width;
            barrier_thickness = 0;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][0] = 0.15;
            miller_value[0][0] = 1.5;
            horiz_dielectric_constant[0][0] = 1.414;
            vert_dielectric_constant[0][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
                                      fringe_cap);

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
            wire_width = wire_pitch[0][1] / 2;
            aspect_ratio[0][1] = 3.0;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1] = 0.15;
            miller_value[0][1] = 1.5;
            horiz_dielectric_constant[0][1] = 1.414;
            vert_dielectric_constant[0][1] = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
            aspect_ratio[0][2] = 3.0;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.3;
            miller_value[0][2] = 1.5;
            horiz_dielectric_constant[0][2] = 1.414;
            vert_dielectric_constant[0][2] = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.003;
            dishing_thickness = 0;
            alpha_scatter = 1.05;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.15;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 2.104;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.15;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 2.104;
            vert_dielectric_constant[1][1] = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2] = 0.275;
            miller_value[1][2] = 1.5;
            horiz_dielectric_constant[1][2] = 2.104;
            vert_dielectric_constant[1][2] = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.022;//micron
            wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.022);//F/micron
            wire_r_per_micron[1][3] = 12 / 0.022;//ohm/micron
        }

        else if (tech == 16) {
            //Aggressive projections.
            wire_pitch[0][0] = 2.5 * g_ip->F_sz_um;//local
            aspect_ratio[0][0] = 3.0;
            wire_width = wire_pitch[0][0] / 2;
            wire_thickness = aspect_ratio[0][0] * wire_width;
            wire_spacing = wire_pitch[0][0] - wire_width;
            barrier_thickness = 0;
            dishing_thickness = 0;
            alpha_scatter = 1;
            wire_r_per_micron[0][0] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][0] = 0.108;
            miller_value[0][0] = 1.5;
            horiz_dielectric_constant[0][0] = 1.202;
            vert_dielectric_constant[0][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[0][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][0], miller_value[0][0], horiz_dielectric_constant[0][0], vert_dielectric_constant[0][0],
                                      fringe_cap);

            wire_pitch[0][1] = 4 * g_ip->F_sz_um;//semi-global
            aspect_ratio[0][1] = 3.0;
            wire_width = wire_pitch[0][1] / 2;
            wire_thickness = aspect_ratio[0][1] * wire_width;
            wire_spacing = wire_pitch[0][1] - wire_width;
            wire_r_per_micron[0][1] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][1] = 0.108;
            miller_value[0][1] = 1.5;
            horiz_dielectric_constant[0][1] = 1.202;
            vert_dielectric_constant[0][1] = 3.9;
            wire_c_per_micron[0][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][1], miller_value[0][1], horiz_dielectric_constant[0][1], vert_dielectric_constant[0][1],
                                      fringe_cap);

            wire_pitch[0][2] = 8 * g_ip->F_sz_um;//global
            aspect_ratio[0][2] = 3.0;
            wire_width = wire_pitch[0][2] / 2;
            wire_thickness = aspect_ratio[0][2] * wire_width;
            wire_spacing = wire_pitch[0][2] - wire_width;
            wire_r_per_micron[0][2] = wire_resistance(BULK_CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[0][2] = 0.216;
            miller_value[0][2] = 1.5;
            horiz_dielectric_constant[0][2] = 1.202;
            vert_dielectric_constant[0][2] = 3.9;
            wire_c_per_micron[0][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[0][2], miller_value[0][2], horiz_dielectric_constant[0][2], vert_dielectric_constant[0][2],
                                      fringe_cap);

            //Conservative projections
            wire_pitch[1][0] = 2.5 * g_ip->F_sz_um;
            aspect_ratio[1][0] = 2.0;
            wire_width = wire_pitch[1][0] / 2;
            wire_thickness = aspect_ratio[1][0] * wire_width;
            wire_spacing = wire_pitch[1][0] - wire_width;
            barrier_thickness = 0.002;
            dishing_thickness = 0;
            alpha_scatter = 1.05;
            wire_r_per_micron[1][0] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][0] = 0.108;
            miller_value[1][0] = 1.5;
            horiz_dielectric_constant[1][0] = 1.998;
            vert_dielectric_constant[1][0] = 3.9;
            fringe_cap = 0.115e-15;
            wire_c_per_micron[1][0] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][0], miller_value[1][0], horiz_dielectric_constant[1][0], vert_dielectric_constant[1][0],
                                      fringe_cap);

            wire_pitch[1][1] = 4 * g_ip->F_sz_um;
            wire_width = wire_pitch[1][1] / 2;
            aspect_ratio[1][1] = 2.0;
            wire_thickness = aspect_ratio[1][1] * wire_width;
            wire_spacing = wire_pitch[1][1] - wire_width;
            wire_r_per_micron[1][1] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][1] = 0.108;
            miller_value[1][1] = 1.5;
            horiz_dielectric_constant[1][1] = 1.998;
            vert_dielectric_constant[1][1] = 3.9;
            wire_c_per_micron[1][1] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][1], miller_value[1][1], horiz_dielectric_constant[1][1], vert_dielectric_constant[1][1],
                                      fringe_cap);

            wire_pitch[1][2] = 8 * g_ip->F_sz_um;
            aspect_ratio[1][2] = 2.2;
            wire_width = wire_pitch[1][2] / 2;
            wire_thickness = aspect_ratio[1][2] * wire_width;
            wire_spacing = wire_pitch[1][2] - wire_width;
            dishing_thickness = 0.1 *  wire_thickness;
            wire_r_per_micron[1][2] = wire_resistance(CU_RESISTIVITY, wire_width,
                                      wire_thickness, barrier_thickness, dishing_thickness, alpha_scatter);
            ild_thickness[1][2] = 0.198;
            miller_value[1][2] = 1.5;
            horiz_dielectric_constant[1][2] = 1.998;
            vert_dielectric_constant[1][2] = 3.9;
            wire_c_per_micron[1][2] = wire_capacitance(wire_width, wire_thickness, wire_spacing,
                                      ild_thickness[1][2], miller_value[1][2], horiz_dielectric_constant[1][2], vert_dielectric_constant[1][2],
                                      fringe_cap);
            //Nominal projections for commodity DRAM wordline/bitline
            wire_pitch[1][3] = 2 * 0.016;//micron
            wire_c_per_micron[1][3] = 31e-15 / (256 * 2 * 0.016);//F/micron
            wire_r_per_micron[1][3] = 12 / 0.016;//ohm/micron
        }
        g_tp.wire_local.pitch += curr_alpha *
            wire_pitch[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.R_per_um += curr_alpha *
            wire_r_per_micron[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.C_per_um += curr_alpha *
            wire_c_per_micron[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.aspect_ratio += curr_alpha *
            aspect_ratio[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.ild_thickness += curr_alpha *
            ild_thickness[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.miller_value += curr_alpha *
            miller_value[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.horiz_dielectric_constant += curr_alpha *
            horiz_dielectric_constant[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];
        g_tp.wire_local.vert_dielectric_constant += curr_alpha *
            vert_dielectric_constant[g_ip->ic_proj_type]
            [(ram_cell_tech_type == comm_dram) ? 3 : 0];

        g_tp.wire_inside_mat.pitch += curr_alpha *
            wire_pitch[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.R_per_um += curr_alpha *
            wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.C_per_um += curr_alpha *
            wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.aspect_ratio += curr_alpha *
            aspect_ratio[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.ild_thickness += curr_alpha *
            ild_thickness[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.miller_value += curr_alpha *
            miller_value[g_ip->ic_proj_type][g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.horiz_dielectric_constant += curr_alpha *
            horiz_dielectric_constant[g_ip->ic_proj_type]
            [g_ip->wire_is_mat_type];
        g_tp.wire_inside_mat.vert_dielectric_constant += curr_alpha *
            vert_dielectric_constant [g_ip->ic_proj_type]
            [g_ip->wire_is_mat_type];

        g_tp.wire_outside_mat.pitch += curr_alpha *
            wire_pitch[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.R_per_um += curr_alpha *
            wire_r_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.C_per_um += curr_alpha *
            wire_c_per_micron[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.aspect_ratio += curr_alpha *
            aspect_ratio[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.ild_thickness += curr_alpha *
            ild_thickness[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.miller_value += curr_alpha *
            miller_value[g_ip->ic_proj_type][g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.horiz_dielectric_constant += curr_alpha *
            horiz_dielectric_constant[g_ip->ic_proj_type]
            [g_ip->wire_os_mat_type];
        g_tp.wire_outside_mat.vert_dielectric_constant += curr_alpha *
            vert_dielectric_constant [g_ip->ic_proj_type]
            [g_ip->wire_os_mat_type];

        g_tp.unit_len_wire_del = g_tp.wire_inside_mat.R_per_um *
            g_tp.wire_inside_mat.C_per_um / 2;

        g_tp.sense_delay += curr_alpha * SENSE_AMP_D;
        g_tp.sense_dy_power += curr_alpha * SENSE_AMP_P;

    }
    g_tp.fringe_cap = fringe_cap;

    double rd = tr_R_on(g_tp.min_w_nmos_, NCH, 1);
    double p_to_n_sizing_r = pmos_to_nmos_sz_ratio();
    double c_load = gate_C(g_tp.min_w_nmos_ * (1 + p_to_n_sizing_r), 0.0);
    double tf = rd * c_load;
    g_tp.kinv = horowitz(0, tf, 0.5, 0.5, RISE);
    double KLOAD = 1;
    c_load = KLOAD * (drain_C_(g_tp.min_w_nmos_, NCH, 1, 1, g_tp.cell_h_def) +
                      drain_C_(g_tp.min_w_nmos_ * p_to_n_sizing_r, PCH, 1, 1, g_tp.cell_h_def) +
                      gate_C(g_tp.min_w_nmos_ * 4 * (1 + p_to_n_sizing_r), 0.0));
    tf = rd * c_load;
    g_tp.FO4 = horowitz(0, tf, 0.5, 0.5, RISE);
}